Reduction of Warpage Occurrence Stack-die Qfn through Fea and Statistical Method

In semiconductor packaging, warpage is one of the critical issues during molding stage. It is related to a thermal mismatch i.e. coefficient of thermal expansion (CTE) values and reliability of passive components in the package. Finite element method (FEM) is able to perform extensive structural analysis of quad flat no-lead (QFN) package designs once verified by experiments. 2 factorial is employed to analyse the finite element analysis (FEA) in order to determine the significant factors that affect warpage. A QFN stacked-die strip was developed with six different control factors were constructed using Ansys® and particularly for nodal displacement. The displacement results were verified with experiment data. The FEA results were then subjected to 2 factorial design technique to determine the significant factors. It was found that the mold compound and epoxy layers significantly influenced the warpage formation.